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Halcon Calibration Plate Honeycomb Calibration Board Minimum Line Width 1µm / 0.55µm
Honeycomb Calibration Board
,Halcon Calibration Board 1µM
,Halcon Calibration Plate 0.55µM
Halcon Honeycomb Calibration Board
Circular dot calibration board is a high-precision calibration tool designed for optical systems, ensuring optimal camera calibration, lens distortion correction, and system performance evaluation. Made using advanced photolithography technology, it offers exceptional accuracy with micron-level precision, making it ideal for high-resolution imaging systems and microscopic applications. Its durable, heat-resistant material guarantees long-term stability, and the precise dot pattern ensures uniformity across the entire board, delivering reliable calibration results. This board is fully customizable to meet various calibration needs, making it perfect for industrial cameras, robotics, and automated vision systems.
Product features: sharp edges, high positional accuracy, low expansion coefficient, High precision (with a maximum accuracy of 1um),and customization support.
Applicable scenarios: Machine vision calibration (security, film and television, medical, camera, drone camera, photography studio, scientific research instruments, and other equipment).
Base material: The base material of the dot calibration plate is optional, and different base materials (such as glass, ceramic, film, aluminum plate, etc.) can be customized according to different usage scenarios, environments, and accuracy requirements.
1. Glass substrate parameters:
| Design |
Substrate |
||
|
Manufacturing Process |
Photolithography |
Glass substrate |
Quartz glass (fused silica)/soda glass |
|
Minimum line width |
1µm / 0.55µm |
Transmittance rate(@550nm) |
>95% |
|
Feature accuracy |
±1µm |
Coefficient of thermal expansion (20-200°C) |
<5.0×10⁻⁷/K |
|
Coating |
Yellow chromium, bright chromium , blue chromium (low reflectivity) |
Expansion ratio(20-200°C) |
0.00006% (0.6µm/°C of 1m) |
|
Reflectance |
< 13.4% @550nm |
Surface flatness |
<0.55µm (length<50mm) |
|
< 1.8% @650nm |
<2µm (length<100mm) |
||
|
< 2.67% @750nm |
<5µm (length>100mm) |
||
|
Coating accuracy |
120nm (±0.20nm) |
Surface roughness |
<0.025µm |
|
Optical density OD |
Yellow Chromium 3 (Blue 5) |
Thickness |
1mm,1.6mm,2.3mm,3mm(±0.2mm)(500*500*4.8) |
|
White background |
Minimum line width:10µm |
Minimum/maximum size |
Min: 2×2 mm |
|
White background thickness: 40 µ m (smooth white coating on the back) |
Max: 800×960mm (±0.1mm) |
||
|
Positive & negative shapes |
Positive: pattern opaque Negative: pattern translucent |
Appearance and shape |
Square |
2. Ceramic substrate parameters:
|
Design |
Substrate |
|||||
|
Manufacturing Process |
Photolithography |
Type |
Matte chromium on matte ceramics |
Bright chrome on glossy ceramics |
|
|
|
Type |
Matte ceramic |
Glossy ceramic |
Ceramic substrate |
Zirconia / Alumina |
||
|
Minimum line width |
4µm |
2µm |
Thickness |
1mm (±0.1mm, common) |
2mm (common) |
3mm (±0.1mm) |
|
Feature accuracy |
±2µm |
±2µm |
Surface flatness |
<30µm (length<100mm) |
<60µm (length<200mm) |
|
|
Appearance accuracy |
±0.05mm |
±0.05mm |
Surface flatness |
MIN: 2×2mm (±0.1mm); MAX: 228×228mm (±0.1mm) |
||
|
Coating |
Chromium |
Chromium |
Surface roughness |
<0.2-0.7µm |
||
|
Light coating/matte coating |
Matte chromium coating |
Bright chrome coating |
Coefficient of thermal expansion (40-400°C) |
<6.7×10⁻⁶/K |
||
|
ReflectaCnce |
< 12.88% @550nm |
< 9.56% @550nm |
Unit weight |
≥ 3.66 g/cm³ |
||
|
< 10.62% @650nm |
< 1.89% @650nm |
|||||
|
< 12.23% @750nm |
< 11.168% @750nm |
|||||
|
Coating thickness |
100-120nm |
100-120nm |
Rockwell hardness |
≥80 HRA |
||
|
Positive and negative shapes |
Positive film: opaque pattern, Negative film: transparent pattern |
Appearance and shape |
Laser cutting of any shape |
Square |
Ellipse |
|
|
Protective layer |
The thin film above the chromium layer makes the chromium pattern more durable |
Special shape |
Punch |
Chamfer |
Oblique angle |
|
3. Film substrate parameters:
|
Design |
Film substrate |
||
|
Manufacturing Process |
Lithography (Film Lithography Machine) |
Application |
Used for transmission/backlight /functional testing |
|
Minimum line width |
10 µ m/30 µ m optional |
Coefficient of expansion |
Film shrinks when heated and expands when cooled |
|
Feature accuracy
|
±10µm |
10µm/°C of 1m When the relative temperature is constant,
When the humidity changes by 1 ° C,
A film with a length of 1m will change by 10 µ m (one ten thousandth)
|
|
|
Coating |
Silver bromide |
Transmittance rate(400~700nm) |
>90% ultraviolet<(400~700nm)>infrared |
|
Coating thickness |
2µm |
Film substrate thickness |
0.18mm (±0.01mm) |
|
Optical density OD |
OD>4 when 100% black
(OD value controllable in grayscale)
|
Maximum size |
0.71×0.81m (±0.1mm)(minimum line width 10µm) 1.68×3.5m (±0.1mm)(minimum line width 30µm) |
|
color |
Black grayscale, sine grayscale |
Appearance |
Laser cutting, straight edge cutting, and circular hole hollowing are available |
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